Process Tape
Products
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Bump wafer B/G
Heat-resistance Tape
UV / NON UV Tape
Bump wafer B/G
Bump wafer B/G
- UV Tape for High bump Wafer back grinding
- Below tapes are designed for surface protection wafers during back grinding process
- Easily de-taping from wafer without stress after UV irradiation.
- Pitch of Ball(100~300㎛)’s securing a stable process
![](https://semicontape.com/wp-content/uploads/2023/06/제목을-입력해주세요_-001-2023-06-26T215628.966-1024x576.png)
Heat-resistance Tape
Heat-resistance Tape
- Heat-resistance PCB or Cu-L/F Backside Polyimide Adhesive Tape
- Heat-resistance Glass substrate process tape
- For Semiconductor Packages to prevent resin leaking.
- UV Tape for High bump Wafer back grinding
![](https://semicontape.com/wp-content/uploads/2023/06/제목을-입력해주세요_-002-1024x576.png)
UV / NON UV Tape
UV / NON UV Tape
- UV & Non UV for wafer Back Grinding , sawing
- Below tapes are designed for surface protection wafers during B/G or sawing process
- LED, PCB for module dicing
- Excellent Expanding & Stable Chemical resistance
- Optimized adhesive strength works easy de-taping without stress.c